MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
Wafer Laser Marking Equipment Wafer Marking Series
Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.
FARLEY·LASERLAB AUTO: Wafer Laser Marking Equipment
Wafer Laser Marking Equipment Wafer Marking Series
Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.
Wafer Laser Marking Equipment Wafer Marking Series
This machine achieves full-auto laser marking for 2–6 inch wafers via wafer manipulator and coaxial vision positioning.
High automation
Special robot for wafer automatic picking and placing, automatic focusing
Strong compatibility
With different light sources, it can adapt to different accuracy levels
High fault tolerance
Intelligent, visual positioning + automatic edge finding, high fault tolerance
Features:
For semiconductor wafer marking
Wafer robot auto pick & place
Multi-light source adaptive
2–6 inch wafer compatible
Auto focusing function
Vision positioning with high fault tolerance
Wafer Laser Marking Equipment – Technical Specifications
| Item | Main parameters | ||
|---|---|---|---|
| Laser | Model | LSF20 | LSU5EB |
| Laser light source | Fiber laser | UV laser | |
| Laser wavelength | 1064nm | 355nm | |
| Average power | 20W | 5W | |
| Performance | Machining accuracy | ±0.1mm | ±0.05mm |
| Max width | 150×150mm | 150×150mm | |
| Support document format | bmp,jpg,png,ai,dxf,dst,plt | ||
| Others | Power supply specification | 2.0KW/AC220V/50HZ | |
| Temperature | 0-40℃ | ＜35℃ | |
| Overall size（length×width×height） | 1250mm*900mm*1900mm | ||
Samples Display
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