MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
Wafer Laser Slotting Equipment Wafer Slotting Series
This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.
FARLEY·LASERLAB AUTO: Wafer Laser Slotting Equipment
Wafer Laser Slotting Equipment Wafer Slotting Series
This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.
Wafer Laser Slotting Equipment Wafer Slotting Series
For 8-inch+ semiconductor wafers including low-k and GaN, this machine uses ultra-short pulse laser and spatial light modulation, integrating coating, slotting and cleaning with high processing quality and efficiency.
Features:
Fits 8-inch and above wafers
Ultra-short pulse low thermal impact
Adjustable laser shaping spot
Supports low-k & GaN wafers
High-precision visual positioning
Integrated coating, slotting and cleaning
Wafer Laser Slotting Equipment – Technical Specifications
| Item | Main parametetrs | |
|---|---|---|
| Laser | Center wavelength | ~532nm |
| Cutting head | Spatial light shaping module | |
| Performance | Effective working stroke | 300x400mm(optional) |
| Repetitive positioning accuracy | ±1μm | |
| Visual positioning | Automatic visual positioning | |
| Slot depth | ≥10µm | |
| Others | Wafer size | 8 inch （12inch is compatible ） |
| Processing process | Protective liquid coating – wafer grooving – cleaning | |
| Processing object | Low – K wafers, silicon-based Gan, etc | |
High quality
Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position
High efficiency
Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast.
High integration
Integrated protective liquid coating, wafer slotting and cleaning module.
Samples Display
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This equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants.
This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system